Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints

doi:10.1007/s10854-019-02764-1

	Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints
	Zhang, Xudong 1; Hu, Xiaowu 1; Jiang, Xiongxin 1; Zhou, Liuru 1; Li, Qinglin2
	2020-02
发表期刊	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN	0957-4522
卷号	31 期号:3 页码:2320-2330
摘要	An accelerator, 3-(2-benzothiazolylthio)-1-propanesulfonsaure (ZPS), and a suppressor, polyethylene glycol (PEG), were employed and formulated with chloride ions (Cl-) in plating solution containing electrolytes (CuSO4 and H2SO4) to prepare Cu film, respectively. Microstructural characterization using transmission electron microscopy and electron backscatter diffraction revealed that the addition of PEG could inhibit the formation of twins and the ZPS had a significant promoting effect. The results of X-ray diffraction indicated the preferred crystallographic orientation (200) of entire electroplated Cu films was changed with the addition of PEG in basic plating solution. The function of ZPS altered the preferred crystallographic orientation from (200) to (111). The roughness of electroplated Cu film was analyzed by scanning electron microscopy and atomic force microscopy. The Cu grain size increased and the Cu surface became rough (RMS: 238.4 nm) under the function of ZPS. The impurity examination based on X-ray photoelectron spectroscopy and electron microprobe analysis indicated that the addition of PEG and ZPS resulted in high-level impurity incorporation, inducing the formation of massive voids within Cu3Sn layer and causing the microstructural instability of the SAC305/Cu solder joints during aging.
关键词	Additives Atomic force microscopy Binary alloys Chlorine compounds Copper Copper compounds Electron probe microanalysis Electrons High resolution transmission electron microscopy Metallic films Scanning electron microscopy Tin alloys Tin metallography X ray photoelectron spectroscopy Crystallographic orientations Electron back scatter diffraction Electroplated copper film Electroplated Cu films Impurity incorporation Micro-structural characterization Microstructural instability Plating solutions
DOI	10.1007/s10854-019-02764-1
收录类别	SCI ; SCIE
语种	英语
WOS研究方向	Engineering ; Materials Science ; Physics
WOS类目	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:000512889300056
出版者	SPRINGER
EI入藏号	20195207931168
EI主题词	Copper metallography
EI分类号	544.1 Copper - 546.2 Tin and Alloys - 741.3 Optical Devices and Systems - 801 Chemistry - 803 Chemical Agents and Basic Industrial Chemicals
来源库	WOS
引用统计	被引频次：7[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	https://ir.lut.edu.cn/handle/2XXMBERH/76625
专题	省部共建有色金属先进加工与再利用国家重点实验室材料科学与工程学院
通讯作者	Hu, Xiaowu
作者单位	1.Nanchang Univ, Mech & Elect Engn Sch, Key Lab Robot & Welding Automat Jiangxi Prov, Nanchang 330031, Jiangxi, Peoples R China; 2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China
推荐引用方式 GB/T 7714	Zhang, Xudong,Hu, Xiaowu,Jiang, Xiongxin,et al. Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2020,31(3):2320-2330.
APA	Zhang, Xudong,Hu, Xiaowu,Jiang, Xiongxin,Zhou, Liuru,&Li, Qinglin.(2020).Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,31(3),2320-2330.
MLA	Zhang, Xudong,et al."Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 31.3(2020):2320-2330.