Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints
Zhang, Xudong1; Hu, Xiaowu1; Jiang, Xiongxin1; Zhou, Liuru1; Li, Qinglin2
2020-02
Source PublicationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN0957-4522
Volume31Issue:3Pages:2320-2330
AbstractAn accelerator, 3-(2-benzothiazolylthio)-1-propanesulfonsaure (ZPS), and a suppressor, polyethylene glycol (PEG), were employed and formulated with chloride ions (Cl-) in plating solution containing electrolytes (CuSO4 and H2SO4) to prepare Cu film, respectively. Microstructural characterization using transmission electron microscopy and electron backscatter diffraction revealed that the addition of PEG could inhibit the formation of twins and the ZPS had a significant promoting effect. The results of X-ray diffraction indicated the preferred crystallographic orientation (200) of entire electroplated Cu films was changed with the addition of PEG in basic plating solution. The function of ZPS altered the preferred crystallographic orientation from (200) to (111). The roughness of electroplated Cu film was analyzed by scanning electron microscopy and atomic force microscopy. The Cu grain size increased and the Cu surface became rough (RMS: 238.4 nm) under the function of ZPS. The impurity examination based on X-ray photoelectron spectroscopy and electron microprobe analysis indicated that the addition of PEG and ZPS resulted in high-level impurity incorporation, inducing the formation of massive voids within Cu3Sn layer and causing the microstructural instability of the SAC305/Cu solder joints during aging.
DOI10.1007/s10854-019-02764-1
Indexed BySCI
Language英语
WOS Research AreaEngineering ; Materials Science ; Physics
WOS SubjectEngineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS IDWOS:000512889300056
PublisherSPRINGER
Citation statistics
Cited Times:2[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.lut.edu.cn/handle/2XXMBERH/76625
Collection省部共建有色金属先进加工与再利用国家重点实验室
材料科学与工程学院
Corresponding AuthorHu, Xiaowu
Affiliation1.Nanchang Univ, Mech & Elect Engn Sch, Key Lab Robot & Welding Automat Jiangxi Prov, Nanchang 330031, Jiangxi, Peoples R China
2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China
Recommended Citation
GB/T 7714
Zhang, Xudong,Hu, Xiaowu,Jiang, Xiongxin,et al. Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2020,31(3):2320-2330.
APA Zhang, Xudong,Hu, Xiaowu,Jiang, Xiongxin,Zhou, Liuru,&Li, Qinglin.(2020).Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,31(3),2320-2330.
MLA Zhang, Xudong,et al."Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 31.3(2020):2320-2330.
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