Novel insights in growth of intermetallic compounds between Sn-3.0Ag-0.5Cu solder and flexible PCB substrates under strain

doi:10.1007/s10854-019-01271-7

	Novel insights in growth of intermetallic compounds between Sn-3.0Ag-0.5Cu solder and flexible PCB substrates under strain
	Zhang, Xudong 1; Hu, Xiaowu 1; Jiang, Xiongxin 1; Li, Qinglin2 ; Zhou, Liuru 1
	2019-05
发表期刊	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN	0957-4522
卷号	30 期号:10 页码:9410-9420
摘要	The study investigated the effect of tensile and compressive strain on the interfacial reaction of SAC305/Cu system. Experimental results indicated that the thickness of Cu6Sn5 layer on non-strained samples slightly decreased after aging for 120h and increased with prolonged aging time. The applied tensile strain had an enhanced effect on the growth of Cu6Sn5 phase, while the applied compressive strain inhibited the growth of Cu6Sn5 phase. However, the thickness of Cu3Sn layer at SAC305/Cu solder joints increased gradually with increasing aging time, regardless of whether strain was or not applied on the solder joints. Besides, the mean diameter of Cu6Sn5 grain increased in three systems as the aging time was prolonged to 480h. The morphology of Cu6Sn5 grain on non-strained samples gradually changed from round-shape into polyhedron-shape with increased aging time. The morphology of Cu6Sn5 grain under tensile or compressive strain was polyhedron-shape. The Kirkendall voids appeared within Cu3Sn layer in three systems after aging for 120h and the amount of voids increased gradually with prolonged aging time. The applied tensile or compressive strain had an enhanced effect on the formation of voids within Cu3Sn layer and the enhanced effect of applied tensile strain was much remarkable than that of other systems.
DOI	10.1007/s10854-019-01271-7
收录类别	SCI
语种	英语
WOS研究方向	Engineering ; Materials Science ; Physics
WOS类目	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:000468437800035
出版者	SPRINGER
引用统计	被引频次：4[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	https://ir.lut.edu.cn/handle/2XXMBERH/31901
专题	省部共建有色金属先进加工与再利用国家重点实验室材料科学与工程学院
作者单位	1.Nanchang Univ, Mech & Elect Engn Sch, Key Lab Robot & Welding Automat Jiangxi Prov, Nanchang 330031, Jiangxi, Peoples R China; 2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Gansu, Peoples R China
推荐引用方式 GB/T 7714	Zhang, Xudong,Hu, Xiaowu,Jiang, Xiongxin,et al. Novel insights in growth of intermetallic compounds between Sn-3.0Ag-0.5Cu solder and flexible PCB substrates under strain[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(10):9410-9420.
APA	Zhang, Xudong,Hu, Xiaowu,Jiang, Xiongxin,Li, Qinglin,&Zhou, Liuru.(2019).Novel insights in growth of intermetallic compounds between Sn-3.0Ag-0.5Cu solder and flexible PCB substrates under strain.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(10),9410-9420.
MLA	Zhang, Xudong,et al."Novel insights in growth of intermetallic compounds between Sn-3.0Ag-0.5Cu solder and flexible PCB substrates under strain".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.10(2019):9410-9420.

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