Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP

doi:10.1016/j.microrel.2022.114600

	Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
	Yu, Weiyuan; Li, Binbin; Wu, Baolei; Wang, Fengfeng; Wang, Mingkang
	2022-08
发表期刊	Microelectronics Reliability
ISSN	0026-2714
卷号	135
摘要	With the application of the third-generation semiconductor SiC in high-power, high-current-density devices, the service temperature of electronic devices is getting higher and higher, and the traditional soldering materials and technologies are facing many technical problems, making it difficult to achieve the goal of "low-temperature connection and high-temperature service." In this paper, a new type of In[sbnd]45Cu composite solder paste was developed to address this problem, and all-Cu2In IMC can be obtained at a service temperature of 600 °C by using ultrasonic-assisted TLP at 260 °C. In this paper, the effects of ultrasonic action time on the microstructure evolution, shear strength, and growth mechanism of intermetallic compounds (IMCs) of the joints were investigated. The results showed that the cavitation effect and acoustic flow effect of ultrasound accelerated the reaction between liquid In and Cu particles, and when the ultrasound action time was 30 s, all In and Cu particles in the joint were transformed into Cu2In, and the shear strength of the joint was 19.69 MPa, at which time the joint was dense due to the expansion of the volume of Cu2In, which eliminated the voids caused by the volume shrinkage of Cu11In9, making it possible for the electronic device to serve for a long time at high temperature. © 2022 Elsevier Ltd
关键词	Binary alloys Copper Copper alloys Indium alloys Lead-free solders Microstructure Shear flow Silicon carbide Soldering Temperature Thermoelectric equipment Wide band gap semiconductors Composite solders Electronics devices In-45cu composite solder paste Intermetallics compounds Microstructures and mechanical properties Service temperature Shears strength Solderpaste Ultrasonic action time Ultrasonic-assisted TLP
DOI	10.1016/j.microrel.2022.114600
收录类别	EI ; SCIE
语种	英语
WOS研究方向	Engineering ; Science & Technology - Other Topics ; Physics
WOS类目	Engineering, Electrical & Electronic ; Nanoscience & Nanotechnology ; Physics, Applied
WOS记录号	WOS:000833593600004
出版者	Elsevier Ltd
EI入藏号	20222812352389
EI主题词	Ultrasonics
EI分类号	538.1.1 Soldering - 544.1 Copper - 544.2 Copper Alloys - 549.3 Nonferrous Metals and Alloys excluding Alkali and Alkaline Earth Metals - 615.4 Thermoelectric Energy - 631.1 Fluid Flow, General - 641.1 Thermodynamics - 712.1 Semiconducting Materials - 753.1 Ultrasonic Waves - 804.2 Inorganic Compounds - 951 Materials Science
来源库	WOS
引用统计	被引频次[WOS]：0 [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	https://ir.lut.edu.cn/handle/2XXMBERH/159365
专题	实验室建设与管理处
通讯作者	Yu, Weiyuan
作者单位	Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Gansu, Peoples R China; Lanzhou Univ Technol, Sch Mat Sci & Engn, Lanzhou 730050, Gansu, Peoples R China
第一作者单位	省部共建有色金属先进加工与再利用国家重点实验室
通讯作者单位	省部共建有色金属先进加工与再利用国家重点实验室
第一作者的第一单位	省部共建有色金属先进加工与再利用国家重点实验室
推荐引用方式 GB/T 7714	Yu, Weiyuan,Li, Binbin,Wu, Baolei,et al. Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP[J]. Microelectronics Reliability,2022,135.
APA	Yu, Weiyuan,Li, Binbin,Wu, Baolei,Wang, Fengfeng,&Wang, Mingkang.(2022).Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP.Microelectronics Reliability,135.
MLA	Yu, Weiyuan,et al."Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP".Microelectronics Reliability 135(2022).