Molecular Dynamics Simulation of Chip Morphology in Nanogrinding of Monocrystalline Nickel

doi:10.3390/coatings12050647

IR > 机电工程学院

	Molecular Dynamics Simulation of Chip Morphology in Nanogrinding of Monocrystalline Nickel
	Wei, Xingchun; Wang, Xiaowen; Qu, Dingfeng; Zhu, Zongxiao; Chen, Weihua; Chen, Wenbang; Shi, Tianzuo; Peng, Bin
	2022-05
发表期刊	COATINGS
卷号	12 期号:5
摘要	In this study, the nanogrinding process for single-crystal nickel was investigated using a molecular dynamics simulation. A series of simulations were conducted with different tool radii and grinding methods to explore the effects of chip morphology, friction forces, subsurface damage, and defect evolution on the nanogrinding process. The results demonstrate that the workpiece atoms at the back of the tool were affected by the forward stretching and upward elastic recovery when no chips were produced. Although the machining depth was the smallest, the normal force was the largest, and dislocation entanglement was formed. The small number of defect atoms indicates that the extent of subsurface damage was minimal. Moreover, when spherical chips were produced, a typical columnar defect was generated. The displacement vector of the chip atoms aligned with the machining direction and as the chips were removed by extrusion, the crystal structure of the chip atoms disintegrated, resulting in severe subsurface damage. By contrast, when strip chips were produced, the displacement vector of the chip atoms deviated from the substrate, dislocation blocks were formed at the initial stage of machining, and the rebound-to-depth ratio of the machined surface was the smallest.
关键词	monocrystalline nickel molecular dynamics chip morphology spherical chip strip chip atomic kinetic energy
DOI	10.3390/coatings12050647
收录类别	SCIE
语种	英语
WOS研究方向	Materials Science ; Physics
WOS类目	Materials Science, Multidisciplinary ; Materials Science, Coatings & Films ; Physics, Applied
WOS记录号	WOS:000801264600001
出版者	MDPI
来源库	WOS
引用统计	被引频次[WOS]：0 [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	https://ir.lut.edu.cn/handle/2XXMBERH/158655
专题	机电工程学院
通讯作者	Zhu, Zongxiao
作者单位	Lanzhou Univ Technol, Sch Mech & Elect Engn, Lanzhou 730050, Peoples R China
第一作者单位	兰州理工大学
通讯作者单位	兰州理工大学
第一作者的第一单位	兰州理工大学
推荐引用方式 GB/T 7714	Wei, Xingchun,Wang, Xiaowen,Qu, Dingfeng,et al. Molecular Dynamics Simulation of Chip Morphology in Nanogrinding of Monocrystalline Nickel[J]. COATINGS,2022,12(5).
APA	Wei, Xingchun.,Wang, Xiaowen.,Qu, Dingfeng.,Zhu, Zongxiao.,Chen, Weihua.,...&Peng, Bin.(2022).Molecular Dynamics Simulation of Chip Morphology in Nanogrinding of Monocrystalline Nickel.COATINGS,12(5).
MLA	Wei, Xingchun,et al."Molecular Dynamics Simulation of Chip Morphology in Nanogrinding of Monocrystalline Nickel".COATINGS 12.5(2022).