Research and application of copper bonding wire in electronic packaging

	Research and application of copper bonding wire in electronic packaging
	Ding, Yu-Tian; Cao, Jun; Xu, Guang-Ji; Kou, Sheng-Zhong; Hu, Yong
	2006-09-01
发表期刊	Zhuzao Jishu/Foundry Technology
ISSN	10008365
卷号	27 期号:9 页码:971-974
摘要	The limitation of the conventional Au and Al-1%Si bonding wire in electronic packaging, and the excellent properties of copper bonding wire were reviewed. Cu bonding wire instead of gold bonding wire and aluminum bonding wire can shorten the bonding space, and improve the CMOS chip frequency and reliability. Moreover, the advantages of single crystal copper as bonding wire were discussed. The comparison result of bonding properties shows that copper bonding wire has excellent properties in electronic packaging.
收录类别	EI
语种	中文
出版者	Science Press, Beijing, China
EI入藏号	20064510226884
文献类型	期刊论文
条目标识符	https://ir.lut.edu.cn/handle/2XXMBERH/151502
专题	省部共建有色金属先进加工与再利用国家重点实验室材料科学与工程学院
作者单位	State Key Laboratory of Gansu Advanced Nonferrous Materials, Lanzhou University of Technology, Lanzhou 730050, China
第一作者单位	兰州理工大学
第一作者的第一单位	兰州理工大学
推荐引用方式 GB/T 7714	Ding, Yu-Tian,Cao, Jun,Xu, Guang-Ji,et al. Research and application of copper bonding wire in electronic packaging[J]. Zhuzao Jishu/Foundry Technology,2006,27(9):971-974.
APA	Ding, Yu-Tian,Cao, Jun,Xu, Guang-Ji,Kou, Sheng-Zhong,&Hu, Yong.(2006).Research and application of copper bonding wire in electronic packaging.Zhuzao Jishu/Foundry Technology,27(9),971-974.
MLA	Ding, Yu-Tian,et al."Research and application of copper bonding wire in electronic packaging".Zhuzao Jishu/Foundry Technology 27.9(2006):971-974.