Preparation, microstructure and properties of copper based wire

doi:10.11817/j.ysxb.1004.0609.2020-39790

	Preparation, microstructure and properties of copper based wire
	Song, Ke-Xing 1,2; Zhou, Yan-Jun 1,2; Mi, Xu-Jun 3; Xiao, Zhu 4; Cao, Jun 5; Ding, Yu-Tian6 ; Wu, Bao-An 7; Feng, Cun-Li 8; Li, Zhou 4; Chen, Ding-Biao 9
	2020-12-01
发表期刊	Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals
ISSN	10040609
卷号	30 期号:12 页码:2845-2874
摘要	The copper wires are widely used in integrated circuit bonding wire, audio and video transmission cable, active wiring harness of medical devices, and various electronic components. It is the key conductor material to ensure the stable transmission of system current and signal. Based on the preparation process of copper wire, this paper reviews the process characteristics of hot mold horizontal continuous casting and cold mold vertical continuous casting, and their relationship with the directional solidification structure of as-cast copper rod. The effects of process parameters such as continuous drawing, heat treatment, and surface coating on the characteristics of grain size, precipitated phase, surface coating, and bonding were discussed. Finally, the development trend of application field and equipment technology of copper based wire under the background of "new infrastructure construction" was prospected. © 2020, Science Press. All right reserved.
关键词	Coatings Construction equipment Continuous casting Heat treatment Image communication systems Molds Conductor materials Electronic component Equipment technology Horizontal continuous casting Infrastructure construction Microstructure and properties Preparation process Process characteristics
DOI	10.11817/j.ysxb.1004.0609.2020-39790
收录类别	EI
语种	中文
出版者	Central South University of Technology
EI入藏号	20210609891936
EI主题词	Wire
EI分类号	405.1 Construction Equipment ; 534.2 Foundry Practice ; 535.2 Metal Forming ; 537.1 Heat Treatment Processes ; 813.2 Coating Materials
引用统计	无
文献类型	期刊论文
条目标识符	https://ir.lut.edu.cn/handle/2XXMBERH/151172
专题	省部共建有色金属先进加工与再利用国家重点实验室材料科学与工程学院
作者单位	1.School of Material Science and Engineering, Henan University of Science and Technology, Luoyang; 471023, China; 2.Provincial and Ministerial Co-construction Collaborative Innovation Center of Nonferrous New Materials and Advanced Processing Technology, Luoyang; 471023, China; 3.General Research Institute for Nonferrous Metals, Beijing; 100088, China; 4.School of Materials Science and Engineering, Central South University, Changsha; 410083, China; 5.School of Mechanical Engineering, Henan Polytechnic University, Jiaozuo; 454000, China; 6.School of Materials Science and Engineering, Lanzhou University of Technology, Lanzhou; 730050, China; 7.Chongqing Materials Research Institute Co., Ltd., Chongqing; 400700, China; 8.Henan Senger Materials Technology Co., Ltd., Jiaozuo; 454010, China; 9.Changzhou Hengfeng Special Conductor Co., Ltd., Changzhou; 213000, China; 10.Henan Youke Electronic Materials Co., Ltd., Jiyuan; 454650, China;
推荐引用方式 GB/T 7714	Song, Ke-Xing,Zhou, Yan-Jun,Mi, Xu-Jun,et al. Preparation, microstructure and properties of copper based wire[J]. Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals,2020,30(12):2845-2874.
APA	Song, Ke-Xing.,Zhou, Yan-Jun.,Mi, Xu-Jun.,Xiao, Zhu.,Cao, Jun.,...&Ding, Yong.(2020).Preparation, microstructure and properties of copper based wire.Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals,30(12),2845-2874.
MLA	Song, Ke-Xing,et al."Preparation, microstructure and properties of copper based wire".Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals 30.12(2020):2845-2874.