Lanzhou University of Technology Institutional Repository (LUT_IR)
Kinetics of Copper Dissolution in Liquid Tin by Direct Current | |
Sun Xuemin; Yu Weiyuan![]() | |
2020-10 | |
发表期刊 | Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
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ISSN | 1002185X |
卷号 | 49期号:10页码:3425-3432 |
摘要 | The dissolution kinetics of copper in liquid tin in the temperature range of 513~573 K were investigated under the influence of a DC current by immersion method. After dissolution, the dissolution thickness and the thickness of IMC layer at Sn/Cu interface were measured and the dissolution activation energy and effective charge Z* were calculated. The temperature distribution and flow field of the liquid tin caused by the current were simulated by Comsol Multiphysics. It is found that the current has a marked effect on the dissolution rate constant. Correspondingly, the application of the current significantly decreases the activation energy of dissolution. Similarly, the direction of the DC current has an effect on dissolution of copper and the growth of IMC. When the electronic flow is in the direction of dissolution, a further increase in dissolution and a decrease in growth of IMC layer are observed which are attributed to electromigration. When the current density is 240 A/cm2, the effective charge Z* decreases with the increase of temperature. © 2020, Science Press. All right reserved. |
关键词 | Activation energy Copper Liquids Rate constants Tin Comsol multiphysics Copper dissolution Direct current Dissolution kinetics Dissolution rates Effective charge Immersion method Temperature range |
收录类别 | EI ; SCIE |
语种 | 中文 |
WOS研究方向 | Materials Science ; Metallurgy & Metallurgical Engineering |
WOS类目 | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering |
WOS记录号 | WOS:000588490000020 |
出版者 | Science Press |
EI入藏号 | 20205009622129 |
EI主题词 | Dissolution |
EI分类号 | 544.1 Copper ; 546.2 Tin and Alloys ; 802.2 Chemical Reactions ; 802.3 Chemical Operations |
来源库 | WOS |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | https://ir.lut.edu.cn/handle/2XXMBERH/150819 |
专题 | 实验室建设与管理处 |
通讯作者 | Yu Weiyuan |
作者单位 | Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China |
第一作者单位 | 省部共建有色金属先进加工与再利用国家重点实验室 |
通讯作者单位 | 省部共建有色金属先进加工与再利用国家重点实验室 |
第一作者的第一单位 | 省部共建有色金属先进加工与再利用国家重点实验室 |
推荐引用方式 GB/T 7714 | Sun Xuemin,Yu Weiyuan,Wu Baolei,et al. Kinetics of Copper Dissolution in Liquid Tin by Direct Current[J]. Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,2020,49(10):3425-3432. |
APA | Sun Xuemin,Yu Weiyuan,Wu Baolei,Yang Guoqing,&Liu Yun.(2020).Kinetics of Copper Dissolution in Liquid Tin by Direct Current.Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,49(10),3425-3432. |
MLA | Sun Xuemin,et al."Kinetics of Copper Dissolution in Liquid Tin by Direct Current".Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering 49.10(2020):3425-3432. |
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