Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder

	Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder
	Yu Weiyuan; Sun Jungang; Liu Yun; Wu Baolei; Lei Zhen
	2020-12
发表期刊	Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
ISSN	1002185X
卷号	49 期号:12 页码:4297-4302
摘要	A lead-free composite solder was synthesized by adding SnO2 nanoparticles into Sn0.6Cu solder by a ultrasonic-assisted method. The effects of the SnO2 nanoparticles on the microstructure, melting property, and the interfacial reaction products of Cu/Sn0.6Cu-xSnO2/Cu brazing joints were investigated. The thickness and grain size of intermetallic compound (IMC) layer were measured. The results show that 1.0% (mass fraction) SnO2 inhibits the growth of β-Sn in the brazing filler metal and refines the grain size. The melting point of the SnO2-containing solder is substantially the same as that of the SnO2-free solder, but the melting range is significantly reduced. In addition, the application of ultrasound during the solders melting process can refine the grains, and the melting point and liquidus temperature of the obtained solder are also lower than those of the conventionally melted solder. The IMC layer at the interface of the solder joint with SnO2 solder is thinner and the grain size is smaller. The main reason is that SnO2 nanoparticles are adsorbed to the crystal plane of the interfacial intermetallic compound, which hinders the interdiffusion between the copper plate and the solder matrix; thus it results in a lower driving force for the formation of IMC, and inhibits the growth of interface compound. © 2020, Science Press. All right reserved.
关键词	Binary alloys Brazing Brazing filler metals Grain size and shape Intermetallics Melting point Microstructure Nanoparticles Synthesis (chemical) Brazing joints Composite solders Crystal planes Driving forces Interfacial intermetallics Liquidus temperature Melting process Melting properties
收录类别	EI ; SCIE
语种	中文
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000607448600038
出版者	Science Press
EI入藏号	20210509850511
EI主题词	Lead-free solders
EI分类号	531.1 Metallurgy ; 538.1.1 Soldering ; 761 Nanotechnology ; 802.2 Chemical Reactions ; 931.2 Physical Properties of Gases, Liquids and Solids ; 933 Solid State Physics ; 951 Materials Science
来源库	WOS
引用统计	被引频次：2[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	https://ir.lut.edu.cn/handle/2XXMBERH/150785
专题	实验室建设与管理处
通讯作者	Yu Weiyuan
作者单位	Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China
第一作者单位	省部共建有色金属先进加工与再利用国家重点实验室
通讯作者单位	省部共建有色金属先进加工与再利用国家重点实验室
第一作者的第一单位	省部共建有色金属先进加工与再利用国家重点实验室
推荐引用方式 GB/T 7714	Yu Weiyuan,Sun Jungang,Liu Yun,et al. Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder[J]. Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,2020,49(12):4297-4302.
APA	Yu Weiyuan,Sun Jungang,Liu Yun,Wu Baolei,&Lei Zhen.(2020).Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder.Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,49(12),4297-4302.
MLA	Yu Weiyuan,et al."Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder".Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering 49.12(2020):4297-4302.