Analysis on ground surface in ultrasonic face grinding of silicon carbide (SiC) ceramic with minor vibration amplitude

doi:10.1016/j.ceramint.2021.04.214

	Analysis on ground surface in ultrasonic face grinding of silicon carbide (SiC) ceramic with minor vibration amplitude; Analysis on ground surface in ultrasonic face grinding of silicon carbide (SiC) ceramic with minor vibration amplitude
	Dai, Chenwei 1; Yin, Zhen 1; Wang, Ping2 ; Miao, Qing 1; Chen, Jiajia 3
	2021-08-01
发表期刊	CERAMICS INTERNATIONAL ; CERAMICS INTERNATIONAL
ISSN	0272-8842 ; 0272-8842
卷号	47 期号:15 页码:21959-21968
摘要	Compared to conventional grinding, ultrasonic face grinding of SiC ceramic with vibration amplitude more than 3 mu m has been proved to improve the machining efficiency but usually face the problem of reducing the workpiece surface quality. The material removal mechanism and ground surface quality by ultrasonic face grinding using minor vibration amplitude (less than 1 mu m) still remains uncertain and needs to be further investigated. In the present work, experiments of ultrasonic face grinding of SiC ceramic are carried out to study the influence of processing parameters (e.g. depth of cut, wheel speed and ultrasonic vibration amplitude) on the surface finish. The results show that both the grinding forces and ground surface roughness increase significantly with the increase of depth of cut and the decrease of wheel speed. However, with the increase of ultrasonic vibration amplitude, the grinding forces decrease rapidly first and then keep steady, and the ground surface roughness shows three variation stages: dropping, climbing and stabilizing, which achieves the smallest value of 0.04 mu m at the amplitude of 0.216 mu m. From the analysis of acquired workpiece surface morphology and image processing result, the proportion of chunks and pits on the workpiece surface is reduced due to ductile removal in case of ultrasonic vibration amplitude less than 0.2 mu m, but increases when the amplitude is more than 0.2 mu m because the material is removed in brittle domain. Finally, a sample machined at relatively high wheel speed and minor vibration amplitude is provided to support the findings. The proposed investigation provides a new approach to achieve mirror surface of SiC ceramic using ultrasonic face grinding.; Compared to conventional grinding, ultrasonic face grinding of SiC ceramic with vibration amplitude more than 3 mu m has been proved to improve the machining efficiency but usually face the problem of reducing the workpiece surface quality. The material removal mechanism and ground surface quality by ultrasonic face grinding using minor vibration amplitude (less than 1 mu m) still remains uncertain and needs to be further investigated. In the present work, experiments of ultrasonic face grinding of SiC ceramic are carried out to study the influence of processing parameters (e.g. depth of cut, wheel speed and ultrasonic vibration amplitude) on the surface finish. The results show that both the grinding forces and ground surface roughness increase significantly with the increase of depth of cut and the decrease of wheel speed. However, with the increase of ultrasonic vibration amplitude, the grinding forces decrease rapidly first and then keep steady, and the ground surface roughness shows three variation stages: dropping, climbing and stabilizing, which achieves the smallest value of 0.04 mu m at the amplitude of 0.216 mu m. From the analysis of acquired workpiece surface morphology and image processing result, the proportion of chunks and pits on the workpiece surface is reduced due to ductile removal in case of ultrasonic vibration amplitude less than 0.2 mu m, but increases when the amplitude is more than 0.2 mu m because the material is removed in brittle domain. Finally, a sample machined at relatively high wheel speed and minor vibration amplitude is provided to support the findings. The proposed investigation provides a new approach to achieve mirror surface of SiC ceramic using ultrasonic face grinding.
关键词	Ultrasonic face grinding Ultrasonic face grinding Minor vibration amplitude Minor vibration amplitude Grinding forces Grinding forces Ground surface quality Ground surface quality Brittle-ductile transition Brittle-ductile transition
DOI	10.1016/j.ceramint.2021.04.214 ; 10.1016/j.ceramint.2021.04.214
收录类别	EI ; EI ; SCOPUS ; SCOPUS ; SCIE ; SCIE
语种	英语 ; 英语
WOS研究方向	Materials Science ; Materials Science
WOS类目	Materials Science, Ceramics ; Materials Science, Ceramics
WOS记录号	WOS:000677648400005 ; WOS:000677648400005
出版者	ELSEVIER SCI LTD ; ELSEVIER SCI LTD
来源库	WOS
引用统计	被引频次：25[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	https://ir.lut.edu.cn/handle/2XXMBERH/148975
专题	电气工程与信息工程学院
通讯作者	Dai, Chenwei; Yin, Zhen
作者单位	1.Suzhou Univ Sci & Technol, Coll Mech Engn, Suzhou 215009, Peoples R China; 2.Lanzhou Univ Technol, Coll Elect & Informat Engn, Lanzhou 730050, Peoples R China; 3.Nanjing Forestry Univ, Coll Mech & Elect Engn, Nanjing 210016, Peoples R China
推荐引用方式 GB/T 7714	Dai, Chenwei,Yin, Zhen,Wang, Ping,et al. Analysis on ground surface in ultrasonic face grinding of silicon carbide (SiC) ceramic with minor vibration amplitude, Analysis on ground surface in ultrasonic face grinding of silicon carbide (SiC) ceramic with minor vibration amplitude[J]. CERAMICS INTERNATIONAL, CERAMICS INTERNATIONAL,2021,47, 47(15):21959-21968, 21959-21968.
APA	Dai, Chenwei,Yin, Zhen,Wang, Ping,Miao, Qing,&Chen, Jiajia.(2021).Analysis on ground surface in ultrasonic face grinding of silicon carbide (SiC) ceramic with minor vibration amplitude.CERAMICS INTERNATIONAL,47(15),21959-21968.
MLA	Dai, Chenwei,et al."Analysis on ground surface in ultrasonic face grinding of silicon carbide (SiC) ceramic with minor vibration amplitude".CERAMICS INTERNATIONAL 47.15(2021):21959-21968.