Subsurface defect evolution and crystal-structure transformation of single-crystal copper in nanoscale combined machining | |
Li, Haiyan1,2,3; Shao, Zihao1,2; Feng, Ruicheng1,2,3; Qi, Yongnian1; Wu, Qin1,2,3; Lei, Chunli1,2 | |
2021-01-02 | |
发表期刊 | Philosophical Magazine |
ISSN | 14786435 |
卷号 | 101期号:1页码:38-58 |
摘要 | In the paper, molecular dynamics simulation is applied to study the evolution and distribution of subsurface defects during nanoscale machining process of single-crystal copper. The chip-removal mechanism and the machined-surface-generative mechanism are examined through analysis of the dislocation evolution and atomic migration of the workpieces. The findings show that under different stresses and temperatures, the difference of the binding energy leads to a zoned phenomenon in the chip. Owing to elastic deformation, some of the dislocations could be recovered and form surface steps; moreover, the work hardening of the workpiece can be achieved on account of generation of twin boundaries, Lomer-Cottrell dislocations, and stacking fault tetrahedra (SFT) by plastic deformation. A process of evolution of an immobile dislocation group containing stair-rod dislocations into SFT is discovered, which is different from the traditional Silcox-Hirsch mechanism. Furthermore, a growth oscillation phenomenon, which corresponding stacking fault planes growth and retraction during the formation of the stable SFT, is discussed. © 2020 Informa UK Limited, trading as Taylor & Francis Group. |
关键词 | Binding energy Copper Machining Molecular dynamics Nanotechnology Single crystals Stacking faults Strain hardening Crystal structure transformation Dislocation evolution Molecular dynamics simulations Oscillation phenomenon Process of evolution Single crystal copper Stacking fault tetrahedron Stair rod dislocations |
DOI | 10.1080/14786435.2020.1814493 |
收录类别 | SCI ; SCIE ; EI |
语种 | 英语 |
WOS研究方向 | Materials Science ; Metallurgy & Metallurgical Engineering ; Physics |
WOS类目 | Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering ; Physics, Applied ; Physics, Condensed Matter |
WOS记录号 | WOS:000565007200001 |
出版者 | Taylor and Francis Ltd. |
EI入藏号 | 20203609134411 |
EI主题词 | Crystal structure |
EI分类号 | 537.1 Heat Treatment Processes - 544.1 Copper - 604.2 Machining Operations - 761 Nanotechnology - 801.4 Physical Chemistry - 933.1 Crystalline Solids - 933.1.1 Crystal Lattice |
来源库 | Compendex |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | https://ir.lut.edu.cn/handle/2XXMBERH/147241 |
专题 | 机电工程学院 |
通讯作者 | Feng, Ruicheng |
作者单位 | 1.Lanzhou Univ Technol, Sch Mech & Elect Engn, Lanzhou 730050, Peoples R China; 2.Lanzhou Univ Technol, Key Lab Digital Mfg Technol & Applicat, Minist Educ, Lanzhou 730050, Peoples R China; 3.Univ Huddersfield, Ctr Efficiency & Performance Engn, Huddersfield HD1 3DH, W Yorkshire, England |
第一作者单位 | 兰州理工大学 |
通讯作者单位 | 兰州理工大学 |
第一作者的第一单位 | 兰州理工大学 |
推荐引用方式 GB/T 7714 | Li, Haiyan,Shao, Zihao,Feng, Ruicheng,et al. Subsurface defect evolution and crystal-structure transformation of single-crystal copper in nanoscale combined machining[J]. Philosophical Magazine,2021,101(1):38-58. |
APA | Li, Haiyan,Shao, Zihao,Feng, Ruicheng,Qi, Yongnian,Wu, Qin,&Lei, Chunli.(2021).Subsurface defect evolution and crystal-structure transformation of single-crystal copper in nanoscale combined machining.Philosophical Magazine,101(1),38-58. |
MLA | Li, Haiyan,et al."Subsurface defect evolution and crystal-structure transformation of single-crystal copper in nanoscale combined machining".Philosophical Magazine 101.1(2021):38-58. |
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