Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate

doi:10.1007/s10854-020-04882-7

	Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate
	Sun, Xuemin 1; Yu, Weiyuan1 ; Wang, Fengfeng 1; Wang, Yanhong2
	2021-01
发表期刊	Journal of Materials Science: Materials in Electronics
ISSN	09574522
卷号	32 期号:1 页码:1073-1079
摘要	The wetting behavior of molten tin solder on copper substrate under ultrasonic vibrations was investigated by the wetting balance method at 250 °C. The cross-section morphology and microstructure of the specimen were analyzed after the wetting test. The grain size and thickness of intermetallic compounds (IMCs) at the interface were measured by an image-pro software. The ultrasonic sound pressure distribution in the molten tin solder was simulated by finite element analysis. The results showed significant effect of ultrasonic vibrations on the wettability of the molten tin solder on the copper substrate. The wettability was conjunctively determined by the driving and additional forces caused by an interfacial reaction and acoustic streaming, respectively. Acoustic cavitation expedited the interaction of interfacial atoms and facilitated the interfacial reaction, resulting in an increased driving force that contributed to the spreading of the molten tin solder on the copper substrate. © 2021, Springer Science+Business Media, LLC, part of Springer Nature.
关键词	Copper Tin Ultrasonic effects Ultrasonic testing Ultrasonic waves Wetting Acoustic cavitations Additional forces Copper substrates Cross-section morphology Interfacial atoms Ultrasonic sound Ultrasonic vibration Wetting balance methods
DOI	10.1007/s10854-020-04882-7
收录类别	EI ; SCIE
语种	英语
WOS研究方向	Engineering ; Materials Science ; Physics
WOS类目	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:000604257300005
出版者	Springer
EI入藏号	20210109714670
EI主题词	Morphology
EI分类号	544.1 Copper - 546.2 Tin and Alloys - 753.1 Ultrasonic Waves - 753.3 Ultrasonic Applications - 951 Materials Science
来源库	Compendex
引用统计	被引频次：3[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	https://ir.lut.edu.cn/handle/2XXMBERH/147204
专题	实验室建设与管理处土木工程学院
通讯作者	Yu, Weiyuan
作者单位	1.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China; 2.Lanzhou Univ Technol, Sch Civil Engn, Lanzhou 730050, Peoples R China
第一作者单位	省部共建有色金属先进加工与再利用国家重点实验室
通讯作者单位	省部共建有色金属先进加工与再利用国家重点实验室
第一作者的第一单位	省部共建有色金属先进加工与再利用国家重点实验室
推荐引用方式 GB/T 7714	Sun, Xuemin,Yu, Weiyuan,Wang, Fengfeng,et al. Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate[J]. Journal of Materials Science: Materials in Electronics,2021,32(1):1073-1079.
APA	Sun, Xuemin,Yu, Weiyuan,Wang, Fengfeng,&Wang, Yanhong.(2021).Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate.Journal of Materials Science: Materials in Electronics,32(1),1073-1079.
MLA	Sun, Xuemin,et al."Effect of ultrasonic vibration on the wetting behavior of molten tin on copper substrate".Journal of Materials Science: Materials in Electronics 32.1(2021):1073-1079.