Study of the influence of cross-border electronic commerce on chongqing's economic growth
Wei, Qi ; Wang, Lele
2016-03-08
会议名称 14th International Symposium on Distributed Computing and Applications for Business, Engineering and Science, DCABES 2015
会议录名称 Proceedings - 14th International Symposium on Distributed Computing and Applications for Business, Engineering and Science, DCABES 2015
页码 106-109
会议日期 August 18, 2015 - August 24, 2015
会议地点 Guiyang, China
出版者 Institute of Electrical and Electronics Engineers Inc.
摘要 As a branch of electronic commerce, cross-border electronic commerce is considered as a new commodity transaction pattern. Chongqing, the youngest municipality, possesses excellent infrastructure and policies that support the development of cross-border electronic commerce. An econometric model is established in this paper, based on data related to cross-border electronic commerce that occurred in Chongqing. Through this model, this paper tries to analyze the relationship between Chongqing's economic growth and cross-border electronic commerce, furthermore, testifies that cross-border electronic commerce could promote Chongqing's economic growth on an empirical basis. Finally, based on the results of this study, suggestions are given to promote the development of cross-border electronic commerce in Chongqing. © 2015 IEEE.
关键词 Distributed computer systems
Economic analysis
Models
Chongqing
Cross-border electronic commerces
Econometric model
Economic growths
Transaction patterns
DOI 10.1109/DCABES.2015.34
收录类别 EI
语种 英语
EI入藏号 20162902607679
EI主题词 Electronic commerce
来源库 Compendex
分类代码 722.4 Digital Computers and Systems - 723.5 Computer Applications - 911.2 Industrial Economics
引用统计
文献类型 会议论文
条目标识符 https://ir.lut.edu.cn/handle/2XXMBERH/117198
专题 经济管理学院
作者单位 School of Economy and Management, Lanzhou University of Technology, 730050, China
第一作者单位 兰州理工大学
推荐引用方式 GB/T 7714
Wei, Qi,Wang, Lele. Study of the influence of cross-border electronic commerce on chongqing's economic growth[C]:Institute of Electrical and Electronics Engineers Inc.,2016:106-109.
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