Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging

doi:10.1007/s10854-020-02933-7

	Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging
	Xu, Tao 1; Hu, Xiaowu 1; Li, Jiayin 1; Li, Qinglin2
	2020-03
发表期刊	Journal of Materials Science: Materials in Electronics
ISSN	09574522
卷号	31 期号:5 页码:3876-3889
摘要	Coating at the interface of solder joint has a great impact on the growth behavior of intermetallic compounds (IMCs) and the mechanical properties. In this study, the sandwich structure samples of Cu/Sn3.0Ag0.5Cu/Cu solder joints with coatings of Ni(P) monolayer and dual Cu–Ni(P) layers on Cu substrate were designed to conduct the shear test. The mechanical strength, fracture modes, and fractographic morphologies of Sn3.0Ag0.5Cu/Cu, Sn3.0Ag0.5Cu/Ni(P)–Cu, and Sn3.0Ag0.5Cu/Cu–Ni(P)–Cu solder joints reflowed at 280 °C for 10 min and then aged at 150 °C for up to 360 h were investigated. Experimental results show that the mechanical strength of Sn3.0Ag0.5Cu/Cu solder joints firstly increased because of the pinning effect of IMC, and then decreased due to the brittleness of excessive growth of IMC during solid-state aging processes. The Sn3.0Ag0.5Cu/Cu solder joints presented ductile fracture, mixed fracture, and brittle fracture modes during shear testing processes. The shear strength of Sn3.0Ag0.5Cu/Ni(P)–Cu solder joints decreased to about 17 MPa after 120 h thermal aging. At the same time, the shear failure mode of Sn3.0Ag0.5Cu/Ni(P)–Cu solder joints changed from the ductile dominant fracture to the brittle dominant fracture. The shear strength of Sn3.0Ag0.5Cu/Cu–Ni(P)–Cu solder joints remained approximate 21 MPa and the fractured position always occurred inside the IMC layer regardless of aging time. © 2020, Springer Science+Business Media, LLC, part of Springer Nature.
关键词	Coatings Fracture mechanics Fracture testing Sandwich structures Thermal aging Fractographic Fracture behavior Growth behavior Mixed fractures Pinning effects Shear failure mode Solder joints Solid-state aging
DOI	10.1007/s10854-020-02933-7
收录类别	EI ; SCIE
语种	英语
WOS研究方向	Engineering ; Materials Science ; Physics
WOS类目	Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Physics, Applied ; Physics, Condensed Matter
WOS记录号	WOS:000514844300015
出版者	Springer
EI入藏号	20200408086335
EI主题词	Ductile fracture
EI分类号	813.2 Coating Materials - 931.1 Mechanics - 951 Materials Science
来源库	Compendex
分类代码	813.2 Coating Materials - 931.1 Mechanics - 951 Materials Science
引用统计	被引频次：3[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	https://ir.lut.edu.cn/handle/2XXMBERH/115362
专题	材料科学与工程学院
通讯作者	Hu, Xiaowu
作者单位	1.Nanchang Univ, Sch Mech & Elect Engn, Key Lab Robot & Welding Automation Jiangxi Prov, Nanchang 330031, Peoples R China; 2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China
推荐引用方式 GB/T 7714	Xu, Tao,Hu, Xiaowu,Li, Jiayin,et al. Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging[J]. Journal of Materials Science: Materials in Electronics,2020,31(5):3876-3889.
APA	Xu, Tao,Hu, Xiaowu,Li, Jiayin,&Li, Qinglin.(2020).Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging.Journal of Materials Science: Materials in Electronics,31(5),3876-3889.
MLA	Xu, Tao,et al."Fracture behavior and mechanical strength of sandwich structure solder joints with Cu–Ni(P) coating during thermal aging".Journal of Materials Science: Materials in Electronics 31.5(2020):3876-3889.