Mechanical properties of Cu nanowires: Effects of cross-sectional area and temperature
Cao, Hui1,2; Rui, Zhiyuan1; Yang, Fuqian2
2020-07-22
发表期刊Materials Science and Engineering A
ISSN09215093
卷号791
摘要Nanostructured materials likely exhibit different mechanical properties from the corresponding bulk materials and have potential applications in a variety of areas. In this work, we use molecular dynamics simulation with embedded-atom potential to investigate the dependence of the mechanical properties of Cu nanowires of square cross-section, including Young's modulus, yield stress and surface force, on cross-sectional area and temperature for the Cu nanowires with cross-sectional areas in a range of 13.1 to 117.6 nm2 in a temperature range of 100 to 500 K. The simulation results reveal that the Young's modulus increases with the increase of the cross-sectional area at the same temperature and decreases with the increase of temperature for the same cross-sectional area. The yield stress decreases with the increase of the cross-sectional area at the same temperature in the range of 100 to 400 K and increases with the increase of the cross-sectional area at 500 K, while it decreases with the increase of temperature for the same cross-sectional area. The surface force decreases with the increase of the cross-sectional area at the same temperature and with the increase of temperature for the same cross-sectional area. Semi-empirical expressions relating the mechanical properties to temperature are proposed. Using the semi-empirical expressions, the Young's modulus at 0 K is found to decrease with the decrease of the cross-sectional area, and the yield stress at 0 K is found to decrease linearly with the increase of the cross-sectional area. © 2020 Elsevier B.V.
关键词Elastic moduli Molecular dynamics Nanowires Bulk materials Cross sectional area Embedded atom potentials Molecular dynamics simulations Semi-empirical Square cross section Stress decrease Temperature range
DOI10.1016/j.msea.2020.139644
收录类别EI
语种英语
出版者Elsevier Ltd
EI入藏号20202508857109
EI主题词Yield stress
来源库Compendex
分类代码761 Nanotechnology - 801.4 Physical Chemistry - 933 Solid State Physics - 951 Materials Science
引用统计
被引频次:14[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符https://ir.lut.edu.cn/handle/2XXMBERH/115232
专题土木工程学院
兰州理工大学
作者单位1.School of Mechanical and Electronical Engineering, Lanzhou University of Technology, Lanzhou; 730050, China;
2.Materials Program, Department of Chemical and Materials Engineering, University of Kentucky, Lexington; 40513, United States
第一作者单位兰州理工大学
第一作者的第一单位兰州理工大学
推荐引用方式
GB/T 7714
Cao, Hui,Rui, Zhiyuan,Yang, Fuqian. Mechanical properties of Cu nanowires: Effects of cross-sectional area and temperature[J]. Materials Science and Engineering A,2020,791.
APA Cao, Hui,Rui, Zhiyuan,&Yang, Fuqian.(2020).Mechanical properties of Cu nanowires: Effects of cross-sectional area and temperature.Materials Science and Engineering A,791.
MLA Cao, Hui,et al."Mechanical properties of Cu nanowires: Effects of cross-sectional area and temperature".Materials Science and Engineering A 791(2020).
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