Lanzhou University of Technology Institutional Repository (LUT_IR)
Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film | |
Hu, Xiaowu1; Bao, Nifa1; Li, Qinglin2 | |
2019-09 | |
发表期刊 | VACUUM |
ISSN | 0042-207X |
卷号 | 167页码:428-437 |
摘要 | In this study, the effects of isothermal aging on the interfacial reactions, shear strength and failure mode of Sn37Pb/electroplated Cu (EPC)/Kovar solder joints were investigated in detail. Various interfacial intermetallic compound (IMC) layers were formed in all as-reflowed solder joints. The as-reflowed solder joints were aged up to 360 h at 150 degrees C before single-lap shear tests. The microstructure of interfacial IMCs layers was affected by the isothermal aging, as well as deposited thickness of Cu film on Kovar substrate. Single-lap shear tests results revealed that the introduction of Cu film on Kovar significantly improved the shear strength of Sn37Pb/EPC/Kovar solder joints. This is because the Cu film could act as a sacrificial layer and react with molten solder to form a thin Cu-Sn IMCs layer, which was expected to protect Au/Ni films from further reaction with solder, rendering a enhanced bonding strength of joints. The shear strength of Sn37Pb/EPC/Kovar solder joints with same aging time increased first and then decreased with the increase of deposited Cu film thickness. The shear strength of aged solder joints decreased with increasing aging time, which could be ascribed to the thicker IMC layer generated at the joint interface. |
关键词 | Shear strength Electroplated Cu Aging Kovar alloy Microstructure |
DOI | 10.1016/j.vacuum.2019.07.002 |
收录类别 | SCI ; SCIE |
语种 | 英语 |
资助项目 | National Natural Science Foundation of China[51765040] ; Natural Science Foundation of Jiangxi Province[20161BAB206122] ; Postgraduate Innovation special funds of Jiangxi Province[YC2018-S058] |
WOS研究方向 | Materials Science ; Physics |
WOS类目 | Materials Science, Multidisciplinary ; Physics, Applied |
WOS记录号 | WOS:000482245800062 |
出版者 | PERGAMON-ELSEVIER SCIENCE LTD |
EI入藏号 | 20192707146485 |
EI主题词 | Copper alloys |
EI分类号 | 538.1.1 Soldering - 544.2 Copper Alloys - 546.2 Tin and Alloys - 631.1 Fluid Flow, General - 931.1 Mechanics - 932.3 Plasma Physics - 951 Materials Science |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | https://ir.lut.edu.cn/handle/2XXMBERH/31601 |
专题 | 省部共建有色金属先进加工与再利用国家重点实验室 材料科学与工程学院 |
通讯作者 | Hu, Xiaowu |
作者单位 | 1.Nanchang Univ, Sch Mech & Elect Engn, Key Lab Robot & Welding Automat Jiangxi Prov, Nanchang 330031, Jiangxi, Peoples R China; 2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Gansu, Peoples R China |
推荐引用方式 GB/T 7714 | Hu, Xiaowu,Bao, Nifa,Li, Qinglin. Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film[J]. VACUUM,2019,167:428-437. |
APA | Hu, Xiaowu,Bao, Nifa,&Li, Qinglin.(2019).Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film.VACUUM,167,428-437. |
MLA | Hu, Xiaowu,et al."Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film".VACUUM 167(2019):428-437. |
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