Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film
Hu, Xiaowu1; Bao, Nifa1; Li, Qinglin2
2019-09
发表期刊VACUUM
ISSN0042-207X
卷号167页码:428-437
摘要In this study, the effects of isothermal aging on the interfacial reactions, shear strength and failure mode of Sn37Pb/electroplated Cu (EPC)/Kovar solder joints were investigated in detail. Various interfacial intermetallic compound (IMC) layers were formed in all as-reflowed solder joints. The as-reflowed solder joints were aged up to 360 h at 150 degrees C before single-lap shear tests. The microstructure of interfacial IMCs layers was affected by the isothermal aging, as well as deposited thickness of Cu film on Kovar substrate. Single-lap shear tests results revealed that the introduction of Cu film on Kovar significantly improved the shear strength of Sn37Pb/EPC/Kovar solder joints. This is because the Cu film could act as a sacrificial layer and react with molten solder to form a thin Cu-Sn IMCs layer, which was expected to protect Au/Ni films from further reaction with solder, rendering a enhanced bonding strength of joints. The shear strength of Sn37Pb/EPC/Kovar solder joints with same aging time increased first and then decreased with the increase of deposited Cu film thickness. The shear strength of aged solder joints decreased with increasing aging time, which could be ascribed to the thicker IMC layer generated at the joint interface.
关键词Shear strength Electroplated Cu Aging Kovar alloy Microstructure
DOI10.1016/j.vacuum.2019.07.002
收录类别SCI ; SCIE
语种英语
资助项目National Natural Science Foundation of China[51765040] ; Natural Science Foundation of Jiangxi Province[20161BAB206122] ; Postgraduate Innovation special funds of Jiangxi Province[YC2018-S058]
WOS研究方向Materials Science ; Physics
WOS类目Materials Science, Multidisciplinary ; Physics, Applied
WOS记录号WOS:000482245800062
出版者PERGAMON-ELSEVIER SCIENCE LTD
EI入藏号20192707146485
EI主题词Copper alloys
EI分类号538.1.1 Soldering - 544.2 Copper Alloys - 546.2 Tin and Alloys - 631.1 Fluid Flow, General - 931.1 Mechanics - 932.3 Plasma Physics - 951 Materials Science
引用统计
被引频次:8[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符https://ir.lut.edu.cn/handle/2XXMBERH/31601
专题省部共建有色金属先进加工与再利用国家重点实验室
材料科学与工程学院
通讯作者Hu, Xiaowu
作者单位1.Nanchang Univ, Sch Mech & Elect Engn, Key Lab Robot & Welding Automat Jiangxi Prov, Nanchang 330031, Jiangxi, Peoples R China;
2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Gansu, Peoples R China
推荐引用方式
GB/T 7714
Hu, Xiaowu,Bao, Nifa,Li, Qinglin. Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film[J]. VACUUM,2019,167:428-437.
APA Hu, Xiaowu,Bao, Nifa,&Li, Qinglin.(2019).Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film.VACUUM,167,428-437.
MLA Hu, Xiaowu,et al."Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film".VACUUM 167(2019):428-437.
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