Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires
Sun, Pengfei1,2; Li, Zhiwei3; Hou, Jiapeng1; Xu, Aimin3; Wang, Qiang1; Zhang, Yi3; Zhang, Zhenjun1; Zhang, Penglin2; Zhang, Zhefeng1
2022-09
发表期刊ADVANCED ENGINEERING MATERIALS
ISSN1438-1656
卷号24期号:9
摘要In the process of electric power transmission, the defects in the copper wire interact with the electrons which results in a thermal effect, accordingly, causing the changes of microstructure and properties of the copper wire. Herein, the evolution of microstructure, strength, and electrical conductivity of the oxygen-free copper wires annealed at different temperatures is investigated. In addition, the effects of various microstructures on strength and electrical conductivity are quantitatively revealed. In the low-temperature region (80-150 degrees C), dislocation recovery is the main reason for the decrease in strength; while, the increase in electrical conductivity is mainly due to the decrease in dislocation density and the transformation of grain boundary from nonequilibrium state to equilibrium state. In the high-temperature region (above 210 degrees C), the strength loss is mainly related to the increasing recrystallized grain size and the disappearance of dislocations in the recrystallized region. The increase in electrical conductivity is mainly attributed to the significant decrease in grain boundary density and the further recovery of dislocations.
关键词annealing electrical conductivity microstructure evolution oxygen-free copper wire strength
DOI10.1002/adem.202200037
收录类别SCIE ; EI
语种英语
WOS研究方向Materials Science
WOS类目Materials Science, Multidisciplinary
WOS记录号WOS:000773409700001
出版者WILEY-V C H VERLAG GMBH
EI入藏号20221411876015
EI主题词Annealing
EI分类号531.1 Metallurgy535.2 Metal Forming537.1 Heat Treatment Processes544.1 Copper641.1 Thermodynamics701.1 Electricity: Basic Concepts and Phenomena706.1.1 Electric Power Transmission804 Chemical Products Generally951 Materials Science
来源库WOS
引用统计
被引频次:1[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符https://ir.lut.edu.cn/handle/2XXMBERH/158118
专题材料科学与工程学院
通讯作者Hou, Jiapeng; Zhang, Yi
作者单位1.Chinese Acad Sci, Inst Met Res, Shi Changxu Innovat Ctr Adv Mat, 72 Wenhua Rd, Shenyang 110016, Peoples R China;
2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Peoples R China;
3.Zhejiang Huadian Equipment Testing Inst, Natl Qual Supervis & Inspect Ctr Elect Equipment, Hangzhou 310015, Peoples R China
第一作者单位省部共建有色金属先进加工与再利用国家重点实验室
推荐引用方式
GB/T 7714
Sun, Pengfei,Li, Zhiwei,Hou, Jiapeng,et al. Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires[J]. ADVANCED ENGINEERING MATERIALS,2022,24(9).
APA Sun, Pengfei.,Li, Zhiwei.,Hou, Jiapeng.,Xu, Aimin.,Wang, Qiang.,...&Zhang, Zhefeng.(2022).Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires.ADVANCED ENGINEERING MATERIALS,24(9).
MLA Sun, Pengfei,et al."Quantitative Study on the Evolution of Microstructure, Strength, and Electrical Conductivity of the Annealed Oxygen-Free Copper Wires".ADVANCED ENGINEERING MATERIALS 24.9(2022).
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