Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint
Liu, Yun; Yu, Weiyuan; Sun, Xuemin; Wang, Fengfeng
2019-11-16
Source PublicationSOLDERING & SURFACE MOUNT TECHNOLOGY
ISSN0954-0911
Volume32Issue:2Pages:73-81
AbstractPurpose
KeywordIntermetallic compounds Grooves Ultrasonic vibration Dissolution IMC
DOI10.1108/SSMT-05-2019-0018
Indexed BySCI
Language英语
Funding ProjectNational Natural Science Foundation of China[51465032]
WOS Research AreaEngineering ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS SubjectEngineering, Manufacturing ; Engineering, Electrical & Electronic ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS IDWOS:000525226600001
PublisherEMERALD GROUP PUBLISHING LTD
Citation statistics
Cited Times [WOS]:0   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.lut.edu.cn/handle/2XXMBERH/76641
Collection实验室建设与管理处
省部共建有色金属先进加工与再利用国家重点实验室
Corresponding AuthorYu, Weiyuan
AffiliationLanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou, Peoples R China
First Author AffilicationState Key Laboratory Of Gansu Advanced Non-Ferrous Metal Materials
Corresponding Author AffilicationState Key Laboratory Of Gansu Advanced Non-Ferrous Metal Materials
First Signature AffilicationState Key Laboratory Of Gansu Advanced Non-Ferrous Metal Materials
Recommended Citation
GB/T 7714
Liu, Yun,Yu, Weiyuan,Sun, Xuemin,et al. Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint[J]. SOLDERING & SURFACE MOUNT TECHNOLOGY,2019,32(2):73-81.
APA Liu, Yun,Yu, Weiyuan,Sun, Xuemin,&Wang, Fengfeng.(2019).Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint.SOLDERING & SURFACE MOUNT TECHNOLOGY,32(2),73-81.
MLA Liu, Yun,et al."Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint".SOLDERING & SURFACE MOUNT TECHNOLOGY 32.2(2019):73-81.
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