Effect of Cu additions on mechanical properties of Ni3Sn4-based intermetallic compounds: First-principles calculations and nano-indentation measurements
Bi, Xiaoyang1; Hu, Xiaowu1; Jiang, Xiongxin1; Li, Qinglin2
2019-06
发表期刊VACUUM
ISSN0042-207X
卷号164页码:7-14
摘要The (Ni,Cu)(3)Sn-4 phase as intermetallic compounds (IMCs) plays an important role in evaluating reliability of solder joints. The first-principles calculations were performed to investigate the phase stability, mechanical properties and electronic structures of Ni3Sn4 and Ni2.5Cu0.5Sn4 IMCs. The results shows that the doping of Cu atom not only reduced the phase stability but also weakened the mechanical properties of Ni3Sn4 crystal structure. Meanwhile, all studied Ni3Sn4-based structures were structural stability. Moreover, the anisotropy of Ni2.5Cu0.5Sn4 (2a site) was strongest while that of Ni2.5Cu0.5Sn4 (4i site) was the weakest. Based on analysis of electronic structures, it indicated that the ionic bonding of Ni-Cu in Ni2.5Cu0.5Sn4 structure was weaker than covalent bonding of nearest-neighbor Ni in Ni3Sn4, which led to an energy reduction with the formation of banding states. By means of nano-indentation measurements, the young's modulus and hardness were measured to be 135.3 +/- 8.4 GPa and 5.0 +/- 0.63 GPa for Ni3Sn4 while 126.3 +/- 7.6 GPa and 4.7 +/- 0.72 GPa for (Ni,Cu)(3)Sn-4, respectively, which were close to the value of calculated results.
关键词Intermetallic compounds Nano-indentation First-principles calculations Mechanical properties
DOI10.1016/j.vacuum.2019.02.049
收录类别SCI ; SCIE
语种英语
资助项目Natural Science Foundation of Jiangxi Province[20161BAB206122]
WOS研究方向Materials Science ; Physics
WOS类目Materials Science, Multidisciplinary ; Physics, Applied
WOS记录号WOS:000467510900002
出版者PERGAMON-ELSEVIER SCIENCE LTD
EI入藏号20191006593024
EI主题词Tin alloys
EI分类号531.1 Metallurgy - 544.1 Copper - 544.2 Copper Alloys - 546.2 Tin and Alloys - 547 Minor, Precious and Rare Earth Metals and Alloys - 761 Nanotechnology - 801.4 Physical Chemistry - 921 Mathematics - 931.3 Atomic and Molecular Physics - 951 Materials Science
引用统计
被引频次:34[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符https://ir.lut.edu.cn/handle/2XXMBERH/31830
专题省部共建有色金属先进加工与再利用国家重点实验室
材料科学与工程学院
通讯作者Hu, Xiaowu
作者单位1.Nanchang Univ, Mech & Elect Engn Sch, Key Lab Robot & Welding Automat Jiangxi Prov, Nanchang 330031, Jiangxi, Peoples R China;
2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Gansu, Peoples R China
推荐引用方式
GB/T 7714
Bi, Xiaoyang,Hu, Xiaowu,Jiang, Xiongxin,et al. Effect of Cu additions on mechanical properties of Ni3Sn4-based intermetallic compounds: First-principles calculations and nano-indentation measurements[J]. VACUUM,2019,164:7-14.
APA Bi, Xiaoyang,Hu, Xiaowu,Jiang, Xiongxin,&Li, Qinglin.(2019).Effect of Cu additions on mechanical properties of Ni3Sn4-based intermetallic compounds: First-principles calculations and nano-indentation measurements.VACUUM,164,7-14.
MLA Bi, Xiaoyang,et al."Effect of Cu additions on mechanical properties of Ni3Sn4-based intermetallic compounds: First-principles calculations and nano-indentation measurements".VACUUM 164(2019):7-14.
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