The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration
Qiu, Hongyu1; Hu, Xiaowu1; Jiang, Xiongxin1; Li, Qinglin2
2019-12
发表期刊MATERIALS LETTERS
ISSN0167-577X
卷号256
摘要The effect of solid-liquid electromigration on Cu-xNi/Sn-3.0Ag-0.5Cu/Cu-xNi (x = 0, 1.5 and 5 wt%) joints bonded at 260 degrees C with electric density of 2.89 x 10(2) A/cm(2) was investigated. The results showed that intermetallic compounds (IMCs) performed a non-interfacial growth in the Cu-5Ni/SAC305 system. The electron backscatter diffraction (EBSD) analysis revealed that the orientation of the Cu6Sn5 [1 0 0] direction parallelled to the direction of electric current, however, the addition of Ni could induce that the growth of (Cu,Ni)(6)Sn-5 grain exhibited isotropy. Additionally, the additional Ni resulted in significant reduction in grain size and enhancement in the tensile strength of joints. (C) 2019 Elsevier B.V. All rights reserved.
关键词Grain orientation Electromigration Intermetallic compounds Diffusion
DOI10.1016/j.matlet.2019.126609
收录类别SCI ; SCIE
语种英语
资助项目Outstanding Young talents funding of jiangxi Province[20192BCB23002]
WOS研究方向Materials Science ; Physics
WOS类目Materials Science, Multidisciplinary ; Physics, Applied
WOS记录号WOS:000489719300018
出版者ELSEVIER
EI入藏号20193607407132
EI主题词Nickel
EI分类号531.1 Metallurgy - 544.2 Copper Alloys - 546.2 Tin and Alloys - 548.1 Nickel - 701.1 Electricity: Basic Concepts and Phenomena
引用统计
被引频次:19[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符https://ir.lut.edu.cn/handle/2XXMBERH/31483
专题省部共建有色金属先进加工与再利用国家重点实验室
材料科学与工程学院
通讯作者Hu, Xiaowu
作者单位1.Nanchang Univ, Sch Mech & Elect Engn, Nanchang 330031, Jiangxi, Peoples R China;
2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Gansu, Peoples R China
推荐引用方式
GB/T 7714
Qiu, Hongyu,Hu, Xiaowu,Jiang, Xiongxin,et al. The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration[J]. MATERIALS LETTERS,2019,256.
APA Qiu, Hongyu,Hu, Xiaowu,Jiang, Xiongxin,&Li, Qinglin.(2019).The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration.MATERIALS LETTERS,256.
MLA Qiu, Hongyu,et al."The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration".MATERIALS LETTERS 256(2019).
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