Lanzhou University of Technology Institutional Repository (LUT_IR)
The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration | |
Qiu, Hongyu1; Hu, Xiaowu1; Jiang, Xiongxin1; Li, Qinglin2 | |
2019-12 | |
发表期刊 | MATERIALS LETTERS |
ISSN | 0167-577X |
卷号 | 256 |
摘要 | The effect of solid-liquid electromigration on Cu-xNi/Sn-3.0Ag-0.5Cu/Cu-xNi (x = 0, 1.5 and 5 wt%) joints bonded at 260 degrees C with electric density of 2.89 x 10(2) A/cm(2) was investigated. The results showed that intermetallic compounds (IMCs) performed a non-interfacial growth in the Cu-5Ni/SAC305 system. The electron backscatter diffraction (EBSD) analysis revealed that the orientation of the Cu6Sn5 [1 0 0] direction parallelled to the direction of electric current, however, the addition of Ni could induce that the growth of (Cu,Ni)(6)Sn-5 grain exhibited isotropy. Additionally, the additional Ni resulted in significant reduction in grain size and enhancement in the tensile strength of joints. (C) 2019 Elsevier B.V. All rights reserved. |
关键词 | Grain orientation Electromigration Intermetallic compounds Diffusion |
DOI | 10.1016/j.matlet.2019.126609 |
收录类别 | SCI ; SCIE |
语种 | 英语 |
资助项目 | Outstanding Young talents funding of jiangxi Province[20192BCB23002] |
WOS研究方向 | Materials Science ; Physics |
WOS类目 | Materials Science, Multidisciplinary ; Physics, Applied |
WOS记录号 | WOS:000489719300018 |
出版者 | ELSEVIER |
EI入藏号 | 20193607407132 |
EI主题词 | Nickel |
EI分类号 | 531.1 Metallurgy - 544.2 Copper Alloys - 546.2 Tin and Alloys - 548.1 Nickel - 701.1 Electricity: Basic Concepts and Phenomena |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | https://ir.lut.edu.cn/handle/2XXMBERH/31483 |
专题 | 省部共建有色金属先进加工与再利用国家重点实验室 材料科学与工程学院 |
通讯作者 | Hu, Xiaowu |
作者单位 | 1.Nanchang Univ, Sch Mech & Elect Engn, Nanchang 330031, Jiangxi, Peoples R China; 2.Lanzhou Univ Technol, State Key Lab Adv Proc & Recycling Nonferrous Met, Lanzhou 730050, Gansu, Peoples R China |
推荐引用方式 GB/T 7714 | Qiu, Hongyu,Hu, Xiaowu,Jiang, Xiongxin,et al. The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration[J]. MATERIALS LETTERS,2019,256. |
APA | Qiu, Hongyu,Hu, Xiaowu,Jiang, Xiongxin,&Li, Qinglin.(2019).The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration.MATERIALS LETTERS,256. |
MLA | Qiu, Hongyu,et al."The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration".MATERIALS LETTERS 256(2019). |
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