Numerical Simulation of WAAM Temperature Field Under Water Cooling

doi:10.11896/cldb.20010070

	Numerical Simulation of WAAM Temperature Field Under Water Cooling
	Chen, Kexuan1,2 ; Wang, Xiangyu 1,2; Li, Yizhao 1; Chen, Yanqiang 1; Du, Yinyin 1
	2021-02-25
发表期刊	Cailiao Daobao/Materials Reports
ISSN	1005-023X
卷号	35 期号:4 页码:04165-04169
摘要	In order to solve the problem of serious heat accumulation caused by the poor heat dissipation condition of the substrate during the process of gas metal wire arc additive manufacturing (WAAM), the heat dissipation method of the substrate with water-cooling copper plate was used to improve the heat dissipation condition of the additive process. The temperature field change of additive manufacturing under the conditions of water cooling and without water cooling are simulated respectively using Abaqus software, and the simulation process is verified experimentally. The results show that the thermal cycle curve of the measurement point of the substrate under the experimental conditions is basically consistent with the simulation result. In both conditions with and without water cooling, the substrate temperature reached the maximum at the seventh layer, and the expanding of the high temperature area on the substrate was the largest. The cooling speed of the substrate under water cooling was much faster than that without water cooling, and the "double peak" effect was more obvious. When the first layer to the seventh layer are stacked, the average temperature gradient distribution of each layer with or without water cooling gradually decreases, but the former is always greater than the latter, and the volume of the molten pool continues to increase. During the seventh to tenth layers, the heat accumulation of the formed part is close to saturation, and it is most prone to severe collapse at this stage. © 2021, Materials Review Magazine. All right reserved.
关键词	3D printers ABAQUS Additives Cooling Plate metal Substrates Temperature Average temperature gradients Dissipation methods Experimental conditions Measurement points Simulation process Substrate temperature Temperature field change Thermal cycle curve
DOI	10.11896/cldb.20010070
收录类别	EI
语种	中文
出版者	Cailiao Daobaoshe/ Materials Review
EI入藏号	20211610216383
EI主题词	Cooling water
EI分类号	641.1 Thermodynamics ; 641.2 Heat Transfer ; 745.1.1 Printing Equipment ; 803 Chemical Agents and Basic Industrial Chemicals ; 921 Mathematics
引用统计	无
文献类型	期刊论文
条目标识符	https://ir.lut.edu.cn/handle/2XXMBERH/148452
专题	材料科学与工程学院
作者单位	1.School of Materials Science and Engineering, Lanzhou University of Technology, Lanzhou; 730050, China; 2.State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou; 730050, China
第一作者单位	材料科学与工程学院; 兰州理工大学
第一作者的第一单位	材料科学与工程学院
推荐引用方式 GB/T 7714	Chen, Kexuan,Wang, Xiangyu,Li, Yizhao,et al. Numerical Simulation of WAAM Temperature Field Under Water Cooling[J]. Cailiao Daobao/Materials Reports,2021,35(4):04165-04169.
APA	Chen, Kexuan,Wang, Xiangyu,Li, Yizhao,Chen, Yanqiang,&Du, Yinyin.(2021).Numerical Simulation of WAAM Temperature Field Under Water Cooling.Cailiao Daobao/Materials Reports,35(4),04165-04169.
MLA	Chen, Kexuan,et al."Numerical Simulation of WAAM Temperature Field Under Water Cooling".Cailiao Daobao/Materials Reports 35.4(2021):04165-04169.