Institutional Repository of Coll Mat Sci & Engn
Effect of Cryogenic Treatment on Extruded Copper Structures | |
Shengquan, Zhang1; Bing, Wang1; Shizhuo, Wang2; Changzhong, Zhao2; Xijing, Wang1; Zhongke, Zhang1 | |
2019-12-06 | |
会议名称 | 3rd International Conference on Traffic Engineering and Transportation System, ICTETS 2019 |
会议录名称 | IOP Conference Series: Materials Science and Engineering |
卷号 | 688 |
期号 | 3 |
会议日期 | September 20, 2019 - September 22, 2019 |
会议地点 | Jiaozuo, China |
出版者 | IOP Publishing Ltd |
摘要 | To improve the quality of electroplated copper anodes and reduce the amount of anode mud, it is necessary to further refine copper grains. In the electronics industry, this is typically accomplished by either extrusion or cryogenic treatment. In this study, samples were subjected to different cryogenic treatment periods, and SEM, EDS, XRD, and hardness tests were performed. It was confirmed that a sub-grain boundary was formed due to the disappearance of vacancies and an increase in dislocations after the cryogenic treatment of extruded copper, which improved the grain refinement and hardness. At longer treatment times, the combination and entanglement of dislocations reduced the strengthening effect, and the copper diffraction peaks changed. However, the distribution of trace phosphorus did not change with the grain refinement distribution. Therefore, the results confirm that cryogenic treatment can be used to refine the grains of extruded copper. © Published under licence by IOP Publishing Ltd. |
关键词 | Anodes Copper Electronics industry Grain boundaries Grain refinement Grain size and shape Hardness Highway engineering Copper grains Copper structures Diffraction peaks Electroplated copper Strengthening effect Subgrain boundaries Treatment time |
DOI | 10.1088/1757-899X/688/3/033087 |
收录类别 | EI |
语种 | 英语 |
EI入藏号 | 20202008673351 |
EI主题词 | Cryogenics |
ISSN | 17578981 |
来源库 | Compendex |
分类代码 | 544.1 Copper - 644.4 Cryogenics - 714.1 Electron Tubes - 951 Materials Science |
引用统计 | 无
|
文献类型 | 会议论文 |
条目标识符 | https://ir.lut.edu.cn/handle/2XXMBERH/117973 |
专题 | 材料科学与工程学院 |
作者单位 | 1.State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metals, Lanzhou University of Technology, Lanzhou, Gansu Province; 730050, China; 2.Jinchuan Nickel du Industrial Co. Ltd., Jinchuan, Gansu Province; 737104, China |
第一作者单位 | 兰州理工大学 |
推荐引用方式 GB/T 7714 | Shengquan, Zhang,Bing, Wang,Shizhuo, Wang,et al. Effect of Cryogenic Treatment on Extruded Copper Structures[C]:IOP Publishing Ltd,2019. |
条目包含的文件 | 条目无相关文件。 |
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